Date sheet
Model |
SW-UVM3 |
SW-UVM5 |
SW-UVM10 |
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Power |
3W |
5W |
10W |
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Laser wavelength |
355nm |
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Marking range |
100mm×100mm(50 × 50 - 600 × 600mm Optional) |
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Line speed |
≤7000mm/s |
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Beam Quanlity |
M 2 <1.2 |
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Laser Medium |
Nd:YVO 4 |
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Pulse Ruputation |
20 - 200 kHz |
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Pulse Duaration |
<15ns(@20kHz |
<15ns(@20kHz |
<20ns(@20kHz |
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Rated power |
1.5kW |
1.5kW |
2.0kW |
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Power supply |
AC220V/50Hz/1Phase/1KW |
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Cooling system |
Water cool ing |
Description
Ultraviolet laser has less thermal effect by comparing with green laser and infrared laser. Various materials
have high absorption rate to alter structure of molecular chain directly by short wavelength laser. UV laser
has more obvious advantages especially for materials which are sensible for thermal effect during
micro-meter or nanometer level super-fining processing.Dust-proof sealed laser cavity without condensation
is designed to avoid damage to expensive optical elements thoroughly and guarantee stable batch
production under industrial environment.
Advantages
1. High security
2. High stability
3. High speed
4. Good beam quality
5. High performance
Application
UV laser are mainly used for marking and surface treatment of circular microchips, thin ceramics, IC
crystal particles, glasses, TFT, LED, plasma screens, precise key marks, glass surface marks, silicon wafer
marks, PCB processing, flat-panel display production, fine tuning of electronic elements, processing of solar
energy battery materials, textiles and thin polymer films, etc.
Samples
Company information
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